Genie Electronics Company
York, Pennsylvania
Quality Certication: RoHS Compliant
www.genieelectronics.com
Automated Surface Mount
Your simple or multi layer boards are perfect for Genie's automated surface mount assembly line. Genie assembles high density designs that include BGA's, 0402 size components, high density quad flat packs, 20 mil pitch components, and RoHS compliant components. Our surface mount equipment will easily accommodate board designs of 12 inches by 10 inches.
It takes more than good equipment to provide reliable and repeatable surface mount assembly. At Genie, we combine our expert production staff and documentation packages with our Fuji equipment to provide the highest level of value available in the electronics manufacturing services industry today. A MPM Accuflex screen printer assures of consistent solder paste application. Our Fuji IP-3 and two CP-IV3 chip shooters place components of a variety of densities and packaging styles. A Conceptronic HVA70 four-zone convection reflow oven provides accurate and precise temperature ramps and stabilization zones for consistent reflow and glue cure
Genie utilizes a full time maintenance staff and intensive maintenance schedule to ensure our equipment is running at its peak condition. Genie is currently running both RoHS compliant and non-RoHS compliant surface mount designs. Our in-process and 100% final inspection plans provide us with the necessary process reviews to ensure consistent quality levels.
Automated Through-Hole
Genie utilizes high speed automated insertion equipment to provide repeatable insertions, reliable cut & clinch, and eliminate the insertion errors that commonly occur with hand stuffing of components.
Automated Radial Lead Component Insertion
- 0.100 inch lead span minimum
- 0.200 inch lead span maximum
- 0.511 inch maximum body diameter
- 0.708 inch maximum component height
Automated Axial Lead Component Insertion
- 0.034 inch maximum lead diameter
- 0.015 inch minimum lead diameter
- 0.320 inch lead span minumum
- 0.600 inch lead span maximum
Hollis Future II Wave Solder Machine
- Automated IC Placement
- 0.300 inch lead spacing maximum
- 6 lead minimum
- 20 lead maximum
- 0.600 inch lead spacing socke
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